Description
SikaBond®-T21 is a one-component, low VOC, permanently elastic, super strong, very low permeability moisture-cure polyurethane adhesive, vapor retarding, crack bridging and sound reduction membrane all-in-one for full surface wood floor bonding.
- 270 % elongation
- Bonds up to 3/4″ solid and engineered wood
- Extremely easy to trowel
- Crack bridging
- Low odor
- Excellent Green Grab
Usage
SikaBond®-T21 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T21 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
Advantages
- 270 % elongation
- Bonds up to 3/4″ solid and engineered wood
- Extremely easy to trowel
- Unlimited subfloor moisture vapor protection
- No moisture testing required – a dry to touch substrate is the only requirement
- Crack bridging
- Low odor
- Excellent Green Grab
- Suitable for common types of wood flooring
- Creates sound reduction layer
- Especially good for problematic woods such as beech and bamboo
- Contains no water
- Eliminates sleepers and plywood over concrete and gypsum substrates
- Permanently elastic – allows planks to expand and contract without damage to the adhesive
- Tenacious bond
Packaging
4 gal. (15.14 L)
Color
Light Brown
Product Details
Sustainability / Certifications / Approvals
ENVIRONMENTAL INFORMATION
| LEED® EQc 4.1 (100 g/L limit) | SCAQMD, Rule 1168 (100 g/L limit) | BAAQMD, Reg. 8, Rule 51 (120 g/L limit) |
| passes | passes | passes |
APPROVALS / STANDARDS
- Independently tested to -STC 62 (ASTM E-90) (6 in. (168 mm) concrete slab, 5/8 in. (19 mm) suspended gypsum ceiling)
- Independently tested to FIIC 52 (ASTM E-989) (8 in. (203 mm) concrete slab, without ceiling
- Reduction of Impact Sound Δ IIC = 21 (ASTM E-2179)
Sag Flow
Consistency: Spreads very easily
Ambient Air Temperature
Room temperature between 60 °F (15 °C) and 90 °F (35 °C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturers’ acclimation and room temperature requirements.
Relative Air Humidity
Between 40 % and 70 % during installation is best for adhesive. See wood floor manufacturer for wood requirements.
Substrate Temperature
During laying and until SikaBond®-T21 has fully cured, substrate temperature should be greater than 60 °F (15 °C) and in case of radiant floor heating, less than 70 °F (20 °C). For substrate temperatures, the standard construction rules are relevant.
Substrate Moisture Content
For use as an adhesive and moisture membrane:
Concrete must be visibly dry. Inspect for any wetness at base of drywall or visible signs of moisture on concrete. Concrete and cement-based underlayments must be fully cured and free of any hydrostatic and/ or moisture problems. When properly applied in accordance with Sika® guidelines, SikaBond®-T21 provides unlimited moisture vapor protection.
For use as an adhesive only:
SikaBond®-T21 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond®-T21 at recommended coverage rate as All-in-One or Sika® MB. See Technical Data Sheet for proper instruction.
Curing Rate
Floor may accept light foot traffic after:
- at 45–50 SF/gal (P5 trowel): after 6–8 h
- at 30–35 SF/gal (SC+MB trowel): after 12 h
(depending on climatic conditions and adhesive layer thickness)
Floor can be sanded after 18 hours
Skin Time / Laying Time
| ~ 45–60 minutes | (at 73 °F (23 °C) and 50 % R.H.) |
