Description
PRODUCT DESCRIPTION
SikaBond®-T55 is a one-component, low-VOC,
permanently elastic, crack bridging, super strong
polyurethane adhesive for full surface bonding of wood
flooring.
USES
SikaBond®-T55 may be used to bond solid and
engineered wood floors (strips, longstrips, planks,
panels, boards), mosaic parquet, industrial parquet,
wood paving (residential) and chip boards to concrete,
mortar, and old existing tiles.
CHARACTERISTICS / ADVANTAGES
▪ 400 % Elongation
▪ Bonds up to 3/4″ solid and engineered wood
▪ Low-odor
▪ Easy to trowel formulation
Fast curing – unfinished wood flooring can be sanded
after 12 hours of cure time
▪
▪ Crack bridging
▪ Suitable for most common types of wood floors
Especially good for problematic woods such as beech
and bamboo
▪
Suitable for bonding wood floors directly onto old
ceramic tiles
▪
▪ Suitable for in-floor radiant heat installation
▪ Footfall-sound-dampening adhesive
▪ Contains no water
Eliminate sleepers and plywood over concrete and
gypsum substrates
▪
Permanently elastic – allows planks to expand and
contract without damage to the adhesive or substrate
▪
ENVIRONMENTAL INFORMATION
LEED® EQc 4.1
(100 g/L limit)
SCAQMD, Rule
1168
(100 g/L limit)
BAAQMD, Reg. 8,
Rule
51 (120 g/L
limit)
passes passes passes
PRODUCT INFORMATION
Chemical Base 1-component Polyurethane, moisture curing
Packaging 5 gal. (18.93 L) unit
Color Tan
Shelf Life 12 months from date of production if stored in undamaged, unopened,
original sealed containers.
Storage Conditions Store in dry conditions and protected from direct sunlight at temperatures
between 50 °F and 77 °F (10 °C and 25 °C).
Density 11 lbs/gal (1.34 kg/l)
TECHNICAL INFORMATION
Shore A Hardness 35 (cured for 28 days)
Tensile Strength 217 psi (cured at 73 °F (23 °C) and 50 % RH)
Elongation at Break ~ 400 % (cured at 73 °F (23 °C) and 50 % RH)
Shear Strength 145 psi (using 1 mm adhesive thickness cured at 73 °F (23 °C) and 50 % RH)
Service Temperature -40 °F (-40 °C) to 158 °F (70 °C)
